Jonathan Pellish Space weather and climate as well as radioactive decay are naturally-occurring phenomena that represent a quantifiable risk to ground-based electrical and/or electronic (E/E) systems. Induced natural radiation environment hazards at ground level include, but are not limited to, both permanent and correctable faults in computer systems, Global Positioning System (GPS) and high-frequency communication disturbances, and electric grid disruption. This talk will give an overview of the hazard implications imposed by the natural radiation environment for road vehicle functional safety. There is a growing and natural synergy between the autonomous vehicle and space system communities.
Riccardo Mariani Smart automotive systems are moving towards being autonomous and are expected to detect and control failures with very minimal or few times no human intervention. Since, hardware and software complexity of systems in general is expected to grow at least by a factor 20 in the next few years; an increased risk of failure has to be addressed with utmost importance and urgency. This tutorial will introduce the challenges of the next generation ADAS (Advanced Driver Assistance Systems) and AV (Autonomous Vehicle) platforms and present details on the connectivity and sensor integration to the automobile system use case. Further, the tutorial provides reference and details on the road vehicle safety standards – ISO 26262, to ensure that standardized functional safety requirements for road vehicles and ISO 21448 Safety of Intended Functionality (SOTIF), for addressing of risks due to hazards resulting from functional insufficiencies of the intended functionality or by reasonably foreseeable misuse by persons. Next, the tutorial establishes the importance of the Responsibility Sensitive Safety (RSS) concept which builds a formal foundation that sets all aspects of human judgment in the context of driving with the goal of setting a “seal of safety” for autonomous vehicle. This tutorial will also include a discussion on architecture models for specifying and designing fault tolerant systems and will also describe the relationships with other disciplines such as Test, Reliability and Security. Finally, conclude with trends around designing for safety.
Janusz Rajski We are witnessing a rapid development of advanced driver assistance systems and autonomous vehicles. Processing of large volume of data generated by sensors used in those systems requires massive computing power which fuels the growth of the automotive IC market. With the growing number of very complex safety-critical components, one of the biggest challenges and stimuli of innovation is the requirement for extremely high quality and long-term reliability. In order to meet the performance demands, the more advanced technology nodes are adopted at an accelerated rate. The new technologies come with new more complex defects and reliability risks. In this talk we will review the key test innovations needed to meet the automotive requirements. We will review DFT techniques for automotive functional safety already used by leading companies as well as those being currently investigated. We will discuss methods to achieve very high quality of manufacturing test, as well as solutions for in-system test that offer best trade-offs between the quality of periodic test and its real time constraints.
Yu Cai Level 3 or higher autonomous driving cars are expected to require up to 1TB of flash storage for 3D maps, sensor data and infotainment content. Vehicles are becoming data centers on wheels, requiring reliable and secure SSD storage. The artificial intelligence (AI) inference for autonomous vehicles also drive a need for fast and real time access to SSD storage and will have very strict requirement on SSD latency. However, the exposure of SSD in vehicles environment with high temperate and large cross temperature range cause significant challenges on the reliability and latency for SSDs. In this talk, we will review the problems, state-of-the art solutions and future directions of SSD in automotive.
The automotive market size for ICs and discrete devices is growing at a rate of greater than 7 percent. Market drivers for this growth include ADAS, Infotainment and Powertrain. Getting an automotive device from initial specification to high volume manufacturing (HVM) can take four years compared to the typical three to six months it takes a consumer device. The requirements for automotive devices are much more complex. Increasing electronic content and zero failure over 15 years of lifetime are the major drivers for the ever increasing reliability requirements.
The major document for any automotive device is the Production Part Approval Process (PPAP). This presentation will show the required content for the PPAP and which roles in an organization will contribute to it. There will also be a deeper dive into the three major automotive standards: IATF16949, AIAG and AEC. For each standard covered in-depth looking at the purpose, what the goal of the standard is, and a few examples for better understanding. Also covered will be the fact that even with all of these standards, not everything is covered. The device manufacturer having specific requirement on top of the standard requirements are more the standard rather than the exception. We will go into detail regarding who has to deliver what to which section and how they are all linked and interacting. The content on the standards will be completed by a look at the recently released ISO26262-11, its intent, scope and expected influence on Semiconductor and OSATs. Finally, a look to how these requirements are fitting together and who is responsible for it.
This comprehensive review will give anyone targeting automotive business an overview of all that is required for automotive devices and the timeline to expect to get to HVM.
“ISO 26262 Functional Safety Standards for Road Vehicles,” known as an Automotive Functional Safety Standard differs from many previous test and quality standards in many ways. The first edition of the Standard was released in November 2011 and the final version was released in December 2019, now it is the time for the industry to start implementing the Standard.
The Standard requires industry to quantify not only traditional intrinsic reliability information but also extrinsic reliability to improve functional safety of the advanced vehicle. It follows traditional result-oriented approaches and it puts strong emphasis on all phases design and integration processes.
Among other changes and improved features of the final version, my presentation will carefully examine the Transient Fault definition and analysis methods. The presentation addresses how to understand Soft Error requirements within the context of the Standard and what it means to us and the industry to fully support the ISO 26262 Standard for the better and safer future vehicles in coming years.
A “Single Event Effect” study has accomplished one of the most important knowledge base to mitigate soft errors from all types of devices over the year. It has been known that soft errors induce the highest failure rate of all other reliability mechanisms combined. We need more innovative solutions and approaches to understand and mitigate Transient Fault Effects in the automotive E/E parts.
The miniaturization issued from advances in manufacturing technologies, leads to an increase of the sensitivity of integrated circuits and systems to the effects of radiation. Among these effects, gathered under the acronym SEE (Single Event Effects), the so-called SEU (Single Event Upsets) is the change of the content of one or many bits as the consequence of the impact of an energetic particle (heavy ion, proton, neutron,…) present in the environment where the circuits operates. This conjuncture in the past concerned only applications devoted to operate in space environment, where particles of high energy (cosmic rays) are present. Nowadays SEEs must be considered even for applications operating at ground level.
Evaluating the sensitivity to the effects of radiation of programmable digital integrated circuits (i.e. microprocessors, digital signal processors and field programmable gate arrays) requires specific methodologies and dedicated tools. Indeed, such an evaluation is based on data gathered from tests performed on-line during which the target circuit is exposed to a flux of particles having features (energy, range in Silicon) somewhat representative of the ones the circuit will encounter in its final environment. These experiments, usually called accelerated radiation ground testing, are performed by means of appropriate radiation facilities entailing thus significant development efforts and cost impact. In this presentation an approach will be presented, describing the corresponding hardware and software tools developed to deal with such experiments at a reasonable cost versus effort trade-off. An approach to predict the SEU error-rate for complex circuits based on combining fault-injection and radiation test will be presented and illustrated by results obtained for representative circuits..
Sang M. Lee With the advent of the mobile device dominating era and the upcoming self-driving car technology, there is strong requirements for higher levels of reliability and quality of semiconductor devices. However, FA engineers are facing more challenges these days since the technology nodes on semiconductor keeps shrinking down to 7nm where the quantum effect begins to kick in. For example, some devices can still use SEM/EDS for cross-section structural analysis while other ones require TEM/EDS/EELS based technology. The SIMS or XPS based depth profiling technology has to upgrade their data analysis technique in order to cope with the lower dimension device structure. In this tutorial session, various types of material analysis technologies will be discussed in terms of the science behind and the capabilities along with case studies.
Young Noh. Kim Semiconductor technologies are one of the key enablers for innovations in modern vehicles. And also, quality and reliability of these semiconductors are key factors for safety feature of Automobile beyond the customer safisfaction. So, This session talk about the reliability of semiconductor which was in general proven the automotive industry by passing stress test based qualification standard according to AEC-Q100, Q101. And then, to achieve these goals and to guarantee its high quality and reliability benchmarks a variety of requirements as ISO26262, robust vailidation, zero defect guideline. etc.
- Program Schedule
Session Time Technical Session Parallel Tutorial
08:40~09:10 Registration 09:10~09:15 Welcome Address and Opening the Conference 09:15~10:10
(Q&A 5 min)
Key Note: SEU – Jonathan Pellish 10:10~11:05
(Q&A 5 min)
Session 1 : IoT
– Riccardo Mariani
SEE Tutorial 1
– Raoul Velazco
11:05~11:15 Break 11:15~12:10
(Q&A 5 min)
Session 2 : EDA
– Janusz Rajski
SEE Tutorial 2
– Raoul Velazco
12:10~13:10 Lunch 13:10~14:05
(Q&A 5 min)
Session 3 : SSD
– Yu Cai
Advanced FA Tutorial 1
– Sang M. Lee
(Q&A 5 min)
Session 4 : DRAM
– Raymond Park
Advanced FA Tutorial 2
– Sang M. Lee
15:00~15:10 Break 15:10~16:05
(Q&A 5 min)
Session 5 : Packaging
– Klaus Pietrczak
Advanced Reliability Test Tutorial 1
– Young Noh. Kim
(Q&A 5 min)
Session 6 : ISO 26262
– Sung Chung
Advanced Reliability Test Tutorial 2
–Young Noh. Kim
17:00~17:20 Raffle and Announcement 17:20~17:30 Closing Remark and Adjournment Networking Time from 17:30 to 18:00
- Technical Session Theme Outline
No. About Tutorial Session Title Speaker Name Company 1 SEU The Natural Radiation Environment as a Hazard to Ground-Level
Presentation Abstract Jonathan
NASA 2 IoT Reliability and Functional Safety for Smart Automotive Systems Presentation Abstract Riccardo
IOTG Intel 3 EDA Test for the Autonomous Age for next Generation Functional Safety Presentation Abstract Janusz
4 Flash SSD Flash-based Solid-State Disks Technology in Autonomous Driving Presentation Abstract Yu Cai 5 DRAM DRAM & Memory Technology for Automotive Application Presentation Abstract Raymond
SK Hynix 6 Packaging Automotive Qualification Requirements for Semiconductors
Presentation Abstract Klaus
7 ISO 26262 Why ISO 26262 Functional Safety Demands New Innovation Presentation Abstract Sung
- Tutorial Session Theme Outline
No. About Tutorial Session Title Speaker Name Company 1 SEE Single Event Effect Tutorial Presentation Abstract Raoul
TIMA 2 FA Materials Analysis Technologies for Advanced FA Presentation Abstract Sang M.
3 Reliability Overview of Automotive Reliability Test Presentation Abstract Young